BRT Community

Please login or register.

Login with username, password and session length
Advanced search  

News:

Welcome to the Bridgetek Community!

Please read our Welcome Note

Technical Support enquires
please contact the team
@ Bridgetek Support

Please refer to our website for detailed information on all our products - Bridgetek - Bridging Technology

Author Topic: BT822  (Read 328 times)

jori

  • Newbie
  • *
  • Posts: 3
    • View Profile
BT822
« on: June 10, 2025, 09:49:35 AM »

When can we expect the sale of BT822 to begin?
Logged

BRT Community Admin

  • Administrator
  • Newbie
  • *****
  • Posts: 25
    • View Profile
Re: BT822
« Reply #1 on: June 11, 2025, 10:35:00 AM »

Hi Jori,

We currently don't have a schedule for the BT822 as we have just released the BT820

Do you a specific Project/Application in mind?

best regards

Community Admin
Logged

jori

  • Newbie
  • *
  • Posts: 3
    • View Profile
Re: BT822
« Reply #2 on: June 11, 2025, 12:53:11 PM »

I don't have a specific project in mind. Just for testing. For now, I'm using FT800, BT815 and BT817 in my projects. I'm asking because BT820 is a BGA package and needs additional external RAM, which complicates the creation of the board itself, it will most likely have to be at least a 4-layer board. According to the specifications that came out some time ago, BT822 will have a built-in 1Gbit RAM, which will significantly simplify the creation of the board. Most likely, the package will not be BGA either, since it will not need the additional pins for communication with external RAM.
Logged

BRT Community Admin

  • Administrator
  • Newbie
  • *****
  • Posts: 25
    • View Profile
Re: BT822
« Reply #3 on: June 11, 2025, 01:51:49 PM »

Hi Jori,

Good to hear you have used previous EVE series IC`s. To aid with quick BT820 design we have brought out MN820 Mini Module.

The module includes the BT820 BGA and on-board 1Gbit DDR3L memory.

Developers can also seamlessly integrate the BT820B into their products by using the MN820 and connecting it via a 100-pin board-to-board connector to their application PCB. This approach reduces development time and eliminates the complexity of designing the high-speed DDR3 subsystem, allowing for a low-cost PCB implementation.

best regards

Community Admin
Logged